Ammonia Based Hydrogen Plant for Semiconductor Manufacturing Atmosphere
An Ammonia Based Hydrogen Plant for Semiconductor Manufacturing Atmosphere is a specialized on-site hydrogen generation solution that supplies ultra-high purity hydrogen (UHP) by cracking anhydrous ammonia (NH₃). This system is widely adopted in semiconductor fabs to create a clean reducing atmosphere for wafer processing, epitaxy, annealing and deposition processes. By converting ammonia into hydrogen with controlled purity levels, it ensures process stability, minimized contamination and improved wafer yield. With compact skid-mounted design, easy integration and low operational cost, the technology offers a reliable alternative to delivered hydrogen cylinders or bulk supply systems while meeting semiconductor-grade purity requirements.
✔ Ultra-High Purity Hydrogen Output (up to 99.999%+) suitable for semiconductor cleanroom requirements.
✔ Stable Reducing Atmosphere to support sensitive thermal annealing, epitaxial growth, and wafer processing.
✔ On-Site Production eliminates supply chain dependency for bulk cylinder hydrogen.
✔ Compact Skid-Mounted Design for easy installation in fabs and process plants.
✔ Automated PLC/SCADA Control for precision, safety and real-time monitoring.
✔ Ammonia Cracker Technology ensures efficient conversion of NH₃ to H₂ + N₂ while maintaining consistent purity levels.
✔ High Reliability & Uptime with redundancy options for critical semiconductor production lines.
✔ Lower Operating Cost compared to compressed hydrogen logistics and cylinder handling.
Our Products
| Parameter | Typical Value |
|---|---|
| Flow | 5 Nm3/hr – 100 Nm3/hr |
| Hydrogen Purity After PSA | ~ 99% Hydrogen |
| Operating /Delivery Pressure | 0.5-1 Bar (Increase with Booster) |
| Dew Point | -60°C to -70°C |
| Feed Gas Source | Hydrogen (75%) & Nitrogen (25%) |
| Automation & Controls | Skid – Mounted with Plc Based controls And Safety Interlocks |
| Purity | 98-99% |